The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 17, 2018

Filed:

Jul. 27, 2016
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Zhihua Li, San Jose, CA (US);

Hemanth K. Dhavaleswarapu, Chandler, AZ (US);

Joseph B. Petrini, Gilbert, AZ (US);

Shankar Devasenathipathy, Tempe, AZ (US);

Steven B. Roach, Gilbert, AZ (US);

Ioan Sauciuc, Phoenix, AZ (US);

Pranav K. Desai, Chandler, AZ (US);

George S. Kostiew, Queen Creek, AZ (US);

Sanjoy K. Saha, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 37/00 (2006.01); B23K 3/08 (2006.01); H01L 23/00 (2006.01); H05K 3/34 (2006.01); B23K 20/02 (2006.01); F25B 21/02 (2006.01);
U.S. Cl.
CPC ...
B23K 37/003 (2013.01); B23K 3/085 (2013.01); B23K 20/023 (2013.01); F25B 21/02 (2013.01); H01L 24/75 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H05K 3/34 (2013.01); F25B 2321/0251 (2013.01); H01L 24/13 (2013.01); H01L 24/29 (2013.01); H01L 2224/131 (2013.01); H01L 2224/291 (2013.01); H01L 2224/75252 (2013.01); H01L 2224/75301 (2013.01); H01L 2224/75502 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/83203 (2013.01);
Abstract

Various embodiments of thermal compression bonding transient cooling solutions are described. Those embodiments include a an array of vertically separated micro channels coupled to a heater surface, wherein every outlet micro channel comprises two adjacent inlet micro channel, and wherein an inlet and outlet manifold are coupled to the array of micro channels, and wherein the heater surface and the micro channels are coupled within the same block.


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