Company Filing History:
Years Active: 2016-2018
Title: Innovations of Pranav K Desai
Introduction
Pranav K Desai is an accomplished inventor based in Chandler, AZ. He has made significant contributions to the field of thermal compression bonding, holding 2 patents that showcase his innovative approach to cooling solutions.
Latest Patents
His latest patents include a high-performance transient uniform cooling solution for the thermal compression bonding process. Various embodiments of these thermal compression bonding transient cooling solutions are described. These embodiments include an array of vertically separated micro channels coupled to a heater surface. Every outlet micro channel comprises two adjacent inlet micro channels, and an inlet and outlet manifold are coupled to the array of micro channels. The heater surface and the micro channels are coupled within the same block, demonstrating a sophisticated design aimed at enhancing efficiency.
Career Highlights
Pranav K Desai is currently employed at Intel Corporation, where he continues to push the boundaries of innovation in technology. His work focuses on developing advanced cooling solutions that are critical for modern electronic devices.
Collaborations
He has collaborated with notable coworkers such as Zhihua Li and Hemanth K Dhavaleswarapu, contributing to a dynamic team environment that fosters creativity and innovation.
Conclusion
Pranav K Desai's contributions to the field of thermal compression bonding and cooling solutions highlight his role as a leading inventor in the industry. His innovative patents and collaborative efforts at Intel Corporation reflect his commitment to advancing technology.