The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2016
Filed:
Dec. 20, 2011
Zhihua LI, Chandler, AZ (US);
Hemanth K. Dhavaleswarapu, Chandler, AZ (US);
Joseph B. Petrini, Gilbert, AZ (US);
Shankar Devasenathipathy, Tempe, AZ (US);
Steven B. Roach, Chandler, AZ (US);
Ioan Sauciuc, Phoenix, AZ (US);
Pranav K. Desai, Chandler, AZ (US);
George S. Kostiew, Chandler, AZ (US);
Sanjoy K. Saha, Chandler, AZ (US);
Zhihua Li, Chandler, AZ (US);
Hemanth K. Dhavaleswarapu, Chandler, AZ (US);
Joseph B. Petrini, Gilbert, AZ (US);
Shankar Devasenathipathy, Tempe, AZ (US);
Steven B. Roach, Chandler, AZ (US);
Ioan Sauciuc, Phoenix, AZ (US);
Pranav K. Desai, Chandler, AZ (US);
George S. Kostiew, Chandler, AZ (US);
Sanjoy K. Saha, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Various embodiments of thermal compression bonding transient cooling solutions are described. Those embodiments include a an array of vertically separated micro channels coupled to a heater surface, wherein every outlet micro channel comprises two adjacent inlet micro channel, and wherein an inlet and outlet manifold are coupled to the array of micro channels, and wherein the heater surface and the micro channels are coupled within the same block.