The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2023
Filed:
Jun. 30, 2017
Intel Corporation, Santa Clara, CA (US);
Dinesh Padmanabhan Ramalekshmi Thanu, Chandler, AZ (US);
Hemanth K. Dhavaleswarapu, Chandler, AZ (US);
Venkata Suresh Guthikonda, Chandler, AZ (US);
John J. Beatty, Chandler, AZ (US);
Yonghao An, Chandler, AZ (US);
Marco Aurelio Cartas Ayala, Chandler, AZ (US);
Luke J. Garner, Chandler, AZ (US);
Peng Li, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Semiconductor packages having a sealant bridge between an integrated heat spreader and a package substrate are described. In an embodiment, a semiconductor package includes a sealant bridge anchoring the integrated heat spreader to the package substrate at locations within an overhang gap laterally between a semiconductor die and a sidewall of the integrated heat spreader. The sealant bridge extends between a top wall of the integrated heat spreader and a die side component, such as a functional electronic component or a non-functional component, or a satellite chip on the package substrate. The sealant bridge modulates warpage or stress in thermal interface material joints to reduce thermal degradation of the semiconductor package.