This inventor holds 1 USPTO granted patent. Top assignee: Intel Corporation. Active years: 2023.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2023
Title: Venkata Suresh Guthikonda: Innovator in Semiconductor Packaging
Introduction
Venkata Suresh Guthikonda is a notable inventor based in Chandler, AZ (US). He has made significant contributions to the field of semiconductor packaging, particularly with his innovative designs that enhance the performance and reliability of semiconductor devices.
Latest Patents
Guthikonda holds 1 patent for his invention titled "Semiconductor package having sealant bridge." This patent describes semiconductor packages that incorporate a sealant bridge between an integrated heat spreader and a package substrate. The design aims to anchor the integrated heat spreader to the package substrate, effectively managing thermal stress and warpage.
Career Highlights
Guthikonda is currently employed at Intel Corporation, where he applies his expertise in semiconductor technology. His work focuses on improving the thermal management of semiconductor packages, which is crucial for the performance of electronic devices.
Collaborations
Throughout his career, Guthikonda has collaborated with talented colleagues, including Dinesh Padmanabhan, Ramalekshmi Thanu, and Hemanth K Dhavaleswarapu. These collaborations have contributed to the advancement of innovative solutions in semiconductor packaging.
Conclusion
Venkata Suresh Guthikonda is a prominent figure in the semiconductor industry, recognized for his innovative patent that addresses critical challenges in thermal management. His contributions continue to influence the development of reliable semiconductor technologies.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile