Chandler, AZ, United States of America

John J Beatty

USPTO Granted Patents = 14 

Average Co-Inventor Count = 3.3

ph-index = 3

Forward Citations = 33(Granted Patents)


Company Filing History:


Years Active: 2007-2023

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14 patents (USPTO):Explore Patents

Title: John J Beatty: Innovator in Semiconductor Packaging

Introduction

John J Beatty is a prominent inventor based in Chandler, AZ (US), known for his significant contributions to semiconductor packaging technology. With a total of 14 patents to his name, Beatty has made a lasting impact in the field through his innovative designs and methods.

Latest Patents

One of Beatty's latest patents is titled "Package with a highly conductive layer deposited on die using throughput additive deposition prior to TIM1 dispense." This patent describes a device package that features dies placed on a substrate, along with one or more layers that possess high thermal conductivity, known as highly-conductive (HC) intermediate layers. The package also includes a lid with legs on its outer periphery, which are attached to the substrate using a sealant. The bottom surface of the lid is positioned over the HC intermediate layers and the dies on the substrate. Additionally, thermal interface materials (TIMs) may be included between the lid's bottom surface and the top surfaces of the HC intermediate layers.

Another notable patent is for a "Semiconductor package having sealant bridge." This invention outlines semiconductor packages that incorporate a sealant bridge between an integrated heat spreader and a package substrate. The sealant bridge anchors the heat spreader to the substrate at specific locations, helping to modulate warpage or stress in thermal interface material joints. This innovation aims to reduce thermal degradation of the semiconductor package.

Career Highlights

John J Beatty is currently employed at Intel Corporation, where he continues to advance semiconductor packaging technologies. His work has been instrumental in developing solutions that enhance the performance and reliability of electronic devices.

Collaborations

Throughout his career, Beatty has collaborated with talented individuals such as Hemanth K Dhavaleswarapu and Jason A Garcia, contributing to various innovative projects in the semiconductor field.

Conclusion

John J Beatty's contributions to semiconductor packaging through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence the development of advanced electronic devices, ensuring better performance and efficiency.

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