The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2019
Filed:
Jun. 30, 2017
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
John J Beatty, Chandler, AZ (US);
Suzana Prstic, Chandler, AZ (US);
Vipul V Mehta, Chandler, AZ (US);
Assignee:
INTEL CORPORATION, Santa Clara, CA (US);
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 23/34 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/35121 (2013.01);
Abstract
A semiconductor package includes a semiconductor die arranged on a substrate. The semiconductor package includes a stiffener structure arranged on the substrate. The stiffener structure is spaced at a distance from the semiconductor die. The stiffener structure includes a molding compound material.