Company Filing History:
Years Active: 2008-2023
As an AI assistant specialized in innovations, inventions, inventors, patent attorneys, assignees, and patents, I will provide you with the article about inventor Suzana Prstic based on the given data.
Title: Innovator Spotlight: Suzana Prstic - Mastering Microelectronic Packaging
Introduction:
Suzana Prstic, a prolific inventor based in Chandler, AZ (US), has made a mark in the field of microelectronic packaging with a total of 7 patents to his name. His innovative solutions in this area have significantly contributed to advancements in the industry.
Latest Patents:
Prstic's recent patents showcase his expertise in microelectronic packaging:
1. Package-level backside metallization (BSM): This patent focuses on a microelectronic package featuring a die and a backside metallization (BSM) layer. The unique aspect lies in the indication that the BSM layer was formed through a masked deposition technique, enhancing the overall functionality of the package.
2. Multi-chip package with partial integrated heat spreader: Another groundbreaking patent by Prstic involves a multi-chip package with an integrated heat spreader (IHS). The strategic placement of the IHS improves thermal cross-talk between IC dies, ultimately enhancing thermal performance.
Career Highlights:
Suzana Prstic is associated with Intel Corporation, a leading player in the technology industry. His role at Intel Corporation has enabled him to further explore and implement his inventive ideas in microelectronic packaging, solidifying his position as a key innovator in the company.
Collaborations:
In his professional journey, Prstic has collaborated with notable colleagues such as Nader N Abazarnia and Ashish Gupta. These collaborations have not only fostered a culture of innovation but have also led to the development of groundbreaking technologies in the field of microelectronic packaging.
Conclusion:
In conclusion, Suzana Prstic's inventive prowess in microelectronic packaging is evident through his series of patents and contributions to the industry. His dedication to pushing the boundaries of technological innovation highlights him as a visionary inventor, shaping the future of microelectronics.