The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2013

Filed:

Dec. 24, 2009
Applicants:

Ashish Gupta, Chandler, AZ (US);

James R. Hastings, Chandler, AZ (US);

Nader N. Abazarnia, Chandler, AZ (US);

Suzana Prstic, Chandler, AZ (US);

Jerome L. Garcia, Chandler, AZ (US);

Inventors:

Ashish Gupta, Chandler, AZ (US);

James R. Hastings, Chandler, AZ (US);

Nader N. Abazarnia, Chandler, AZ (US);

Suzana Prstic, Chandler, AZ (US);

Jerome L. Garcia, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Systems and methods including testing of electronic components are described. One system relates to a system including a thermal control unit adapted to control the temperature of at least a portion of an electronic component during testing. The system includes at least one conduit extending through a portion of the thermal control unit, the conduit sized to permit the flow of a thermal interface material therethrough, the thermal interface material comprising a liquid. The at least one conduit is positioned so that the thermal interface material can be delivered through the conduit and onto the electronic component. The system also includes a device adapted to control the flow of the thermal interface material through the conduit, wherein the flow can be controlled to deliver the thermal interface material to the electronic component and to remove the thermal interface material from the electronic component. Other embodiments are described and claimed.


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