The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 11, 2021
Filed:
Aug. 01, 2019
Intel Corporation, Santa Clara, CA (US);
Muhammad S. Islam, Chandler, AZ (US);
Enisa Harris, Phoenix, AZ (US);
Suzana Prstic, Chandler, AZ (US);
Sergio Chan Arguedas, Chandler, AZ (US);
Sachin Deshmukh, Chandler, AZ (US);
Aravindha Antoniswamy, Phoenix, AZ (US);
Elah Bozorg-Grayeli, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A multi-chip package includes multiple IC die interconnected to a package substrate. An integrated heat spreader (IHS) is located over one or more primary IC die, but is absent from over one or more secondary IC die. Thermal cross-talk between IC dies and/or thermal performance of individual IC dies may be improved by constraining the dimensions of the IHS to be over less than all IC die of the package. A first thermal interface material (TIM) may be between the IHS and the primary IC die, but absent from over the secondary IC die. A second TIM may be between a heat sink and the IHS and also between the heat sink and the secondary IC die. The heat sink may be segmented, or have a non-planarity to accommodate differences in z-height across the IC die and/or as a result of constraining the dimensions of the IHS to be over less than all IC die.