Luke J Garner

Title: Innovations of Luke J Garner

Introduction

Luke J Garner is an accomplished inventor based in Chandler, AZ. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on enhancing the performance and reliability of semiconductor packages.

Latest Patents

Garner's latest patents include innovative designs that improve semiconductor devices. One of his patents, titled "Vias for Package Substrates," describes techniques for a semiconductor device that includes a package substrate with a via pad in a core layer. This design features a first dielectric layer with a through hole that connects to the via pad, and a second dielectric layer that fills the first through hole, ensuring effective connectivity. Another notable patent is "Semiconductor Package Having Sealant Bridge," which introduces a sealant bridge that anchors an integrated heat spreader to a package substrate. This design helps to modulate warpage and stress in thermal interface material joints, thereby reducing thermal degradation of the semiconductor package.

Career Highlights

Luke J Garner is currently employed at Intel Corporation, a leading company in semiconductor manufacturing. His work at Intel has allowed him to push the boundaries of semiconductor technology and contribute to advancements in the industry.

Collaborations

Garner collaborates with talented individuals such as Dinesh Padmanabhan, Ramalekshmi Thanu, and Hemanth K Dhavaleswarapu. These collaborations enhance the innovative efforts within his projects and contribute to the success of their endeavors.

Conclusion

Luke J Garner's contributions to semiconductor technology through his patents and work at Intel Corporation highlight his role as a significant inventor in the field. His innovative designs continue to shape the future of semiconductor devices.