The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 10, 2021
Filed:
Apr. 02, 2016
Intel Corporation, Santa Clara, CA (US);
Eric Li, Chandler, AZ (US);
Kemal Aygun, Tempe, AZ (US);
Kai Xiao, Portland, OR (US);
Gong Ouyang, Olympia, WA (US);
Zhichao Zhang, Chandler, AZ (US);
INTEL CORPORATION, Santa Clara, CA (US);
Abstract
Fine feature formation techniques for printed circuit boards are described. In one embodiment, for example, a method may comprise fabricating a conductive structureon a low density interconnect (LDI) printed circuit board (PCB)according to an LDI fabrication process and forming one or more fine conductive features on the LDI PCB by performing a fine feature formation (FFF) process, the FFF process to comprise removing conductive material of the conductive structure along an excision path to form a fine gap regionwithin the conductive structure. Other embodiments are described and claimed.