Kemal Aygun

Chandler, AZ, United States of America

Kemal Aygun

This inventor holds 109 USPTO granted patents and 18 published patent applications and 6 EPO patents, primarily in Semiconductor Packaging (CPC class H01L23-49838). Top assignee: Intel Corporation. Active years: 2008-2026.

USPTO Granted Patents = 109 

% Patents Active = 81.7

 

Average Co-Inventor Count = 3.7

ph-index = 10

Forward Citations = 336(Granted Patents)

Forward Citations (Not Self Cited) = 262(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Chandler, AZ (US) (2008 - 2021)
  • Tempe, AZ (US) (2017 - 2024)

Company Filing History:


Years Active: 2008-2026

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Areas of Expertise:
Power Delivery
Embedded Bridge Die
Crosstalk Mitigation
High-Speed Signaling
Microelectronic Package
Through-Substrate Optical Vias
Die Interconnect Structures
Multi-Layered Adhesion Films
Memory Die Stacking
High Density Interconnects
Millimeter Wave Antennas
Signal Shielding
109 patents (USPTO):Explore Patents

Title: Kemal Aygun: Innovator Extraordinaire from Intel Corporation

Introduction:

Kemal Aygun, a prolific inventor and innovator hailing from Chandler, Arizona, is making waves in the tech industry with his groundbreaking patents and contributions to the field. As an esteemed member of Intel Corporation, Aygun has cemented his place as a visionary engineer, constantly pushing the boundaries of technology. Let's delve into his latest patents, notable career highlights, and collaborations within the industry.

Latest Patents:

One cannot help but marvel at Aygun's extensive portfolio of patents, currently numbering 91. His recent innovative work revolves around power delivery for embedded bridge dies, utilizing trench structures. These methods and structures involve the integration of dies onto substrate surfaces, embedding interconnect bridges into the substrate, and implementing vertical interconnect structures for the electrical and physical connection to the dies. These inventions highlight Aygun's expertise in optimizing power management and advanced package structures.

Career Highlights:

Aygun's remarkable career has been primarily nurtured at Intel Corporation, one of the leading pioneers in the semiconductor industry. Throughout his tenure, he has demonstrated a remarkable ability to bring cutting-edge ideas to life through practical applications. His groundbreaking contributions have significantly impacted Intel's research and development efforts, solidifying their position at the forefront of technological advancements.

Collaborations:

Collaboration and teamwork have played a pivotal role in Aygun's career. Notably, he has worked alongside esteemed colleagues such as Zhiguo Qian and Zhichao Zhang. These collaborations have not only fostered an exchange of ideas but also led to the development of groundbreaking patents and technological advancements. Aygun's ability to work synergistically with others demonstrates his versatility as well as his dedication to the collective pursuit of innovation.

Conclusion:

Kemal Aygun's remarkable journey as an inventor and engineer has had a profound impact on the technological landscape. With an impressive array of patents under his belt, Aygun's contributions have furthered the realms of power delivery and package structures within the semiconductor industry. As a valued member of Intel Corporation, he continues to inspire and shape advancements in technology. We eagerly anticipate his future endeavors and the impact they will undoubtedly have on the world of innovation.

Profile summary based on public USPTO records.
Please report any incorrect information to [email protected]
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