The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2025
Filed:
Jun. 16, 2021
Intel Corporation, Santa Clara, CA (US);
Pooya Tadayon, Portland, OR (US);
Zhichao Zhang, Chandler, AZ (US);
Brandon Marin, Gilbert, AZ (US);
Tarek Ibrahim, Mesa, AZ (US);
Kemal Aygun, Tempe, AZ (US);
Stephen Smith, Laveen, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Integrated circuit packages may be formed having at least one optical via extending from a first surface of a package substrate to an opposing second surface of the package substrate. The at least one optical via creates an optical link between the opposing surfaces of the package substrate that enables the fabrication of a dual-sided optical multiple chip package, wherein integrated circuit devices can be attached to both surfaces of the package substrate for increased package density.