Laveen, AZ, United States of America

Stephen Smith


Average Co-Inventor Count = 6.9

ph-index = 1


Company Filing History:


Years Active: 2024-2025

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2 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Stephen Smith

Introduction

Stephen Smith is a notable inventor based in Laveen, Arizona. He has made significant contributions to the field of integrated circuit technology, holding two patents that showcase his innovative spirit and technical expertise. His work primarily focuses on enhancing the functionality and efficiency of electronic devices.

Latest Patents

One of Stephen's latest patents is for Through-substrate optical vias. This invention allows integrated circuit packages to be formed with at least one optical via extending from one surface of a package substrate to the opposing surface. This optical link enables the creation of dual-sided optical multiple chip packages, allowing for increased package density by attaching integrated circuit devices to both surfaces.

Another significant patent is for an In-package 3D antenna. This RF chip package includes a housing with a first substrate and a 3-D antenna, along with a second substrate containing multiple semiconductor devices. The design allows for electrical connections between the two substrates, optimizing the integration of the 3-D antenna and RF circuitry within the same chip package. This innovation minimizes costs while significantly improving bandwidth compared to traditional methods.

Career Highlights

Stephen Smith is currently employed at Intel Corporation, a leading technology company known for its advancements in semiconductor manufacturing. His work at Intel has positioned him as a key player in the development of cutting-edge technologies that drive the electronics industry forward.

Collaborations

Stephen has collaborated with talented coworkers such as Zhichao Zhang and Pooya Tadayon. Their combined expertise contributes to the innovative projects at Intel, fostering an environment of creativity and technological advancement.

Conclusion

Stephen Smith's contributions to the field of integrated circuits through his patents demonstrate his commitment to innovation and excellence. His work not only enhances the functionality of electronic devices but also sets the stage for future advancements in technology.

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