The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2024
Filed:
Jan. 26, 2019
Intel Corporation, Santa Clara, CA (US);
Zhenguo Jiang, Chandler, AZ (US);
Omkar Karhade, Chandler, AZ (US);
Srichaitra Chavali, Chandler, AZ (US);
Zhichao Zhang, Chandler, AZ (US);
Jimin Yao, Chandler, AZ (US);
Stephen Smith, Laveen, AZ (US);
Xiaoqian Li, Chandler, AZ (US);
Robert Sankman, Phoenix, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
An RF chip package comprises a housing and one or more conductive contacts designed to electrically connect the RF chip package to other conductive contacts. The housing includes a first substrate, a 3-D antenna on the first substrate, and a second substrate. The second substrate includes a plurality of semiconductor devices and is bonded to the first substrate. An interconnect structure allows for electrical connection between the first and second substrates. In some cases, the first substrate is flip-chip bonded to the second substrate or is otherwise connected to the second substrate by an array of solder balls. By integrating both the 3-D antenna and RF circuitry together in the same chip package, costs are minimized while bandwidth is greatly improved compared to a separately machined 3-D antenna.