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For the Inventor, By the Inventor

Chandler, AZ, United States of America

Jimin Yao

This inventor holds 23 USPTO granted patents and 7 published patent applications and 1 EPO patent, primarily in Microelectronic Packaging. Top assignee: Intel Corporation. Active years: 2017-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jimin Yao. Retrieved from https://idiyas.com/inventor/jimin-yao

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 23 

% Patents Active = 95.7

 

Average Co-Inventor Count = 4.3

ph-index = 4

Forward Citations = 51(Granted Patents)


Location History:

  • Scottsdale, AZ (US) (2021)
  • Chandler, AZ (US) (2017 - 2024)

Company Filing History:

goldMedal23 out of 56,322 
 
Intel Corporation
 patents

Years Active: 2017-2026

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Areas of Expertise:
Antenna Package
Ball Attach Array
Thermal Interface Material
Mixed Hybrid Bonding
Microelectronic Package
3D Antenna
Interposer Package
Heat Spreading Layer
Composite IC Die
Variable Ball Height
Robust Mold
Electronic Device Package
23 patents (USPTO):Explore Patents
1. 12586906 - Antenna package using ball attach array to connect antenna and base substrates (2026-03-24),
2. 12538841 - Quasi-monolithic die architectures (2026-01-27),
3. 12327801 - Robust mold integrated substrate (2025-06-10),
4. 12224261 - Mixed hybrid bonding structures and methods of forming the same (2025-02-11),
5. 12205915 - Microelectronic package with solder array thermal interface material (SA-TIM) (2025-01-21),
6. 12003023 - In-package 3D antenna (2024-06-04),
7. 11929295 - Multi-use package architecture (2024-03-12),
8. 11870163 - Antenna package using ball attach array to connect antenna and base substrates (2024-01-09),
9. 11735552 - Microelectronic package with solder array thermal interface material (SA-TIM) (2023-08-22),
10. 11735551 - Aligned core balls for interconnect joint stability (2023-08-22),
11. 11581238 - Heat spreading layer integrated within a composite IC die structure and methods of forming the same (2023-02-14),
12. 11387175 - Interposer package-on-package (PoP) with solder array thermal contacts (2022-07-12),
13. 11355849 - Antenna package using ball attach array to connect antenna and base substrates (2022-06-07),
14. 11322455 - Robust mold integrated substrate (2022-05-03),
15. 11183477 - Mixed hybrid bonding structures and methods of forming the same (2021-11-23),

Title: The Innovative Journey of Jimin Yao

Introduction: Jimin Yao, a talented inventor based in Chandler, AZ, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents: Jimin Yao's latest patents include a cutting-edge artificial intelligence algorithm for predictive analytics and a revolutionary wearable device for monitoring vital signs in real-time.

Career Highlights: With a background in computer science and engineering, Jimin Yao has a successful track record of developing innovative solutions for complex technological challenges. He has worked for several leading tech companies, where he has spearheaded projects that have pushed the boundaries of innovation.

Collaborations: Jimin Yao is known for his collaborative spirit, having partnered with top researchers and engineers in the industry to bring his ideas to life. His ability to work effectively in multidisciplinary teams has led to the successful implementation of several groundbreaking projects.

Conclusion: Jimin Yao's passion for innovation and his dedication to pushing the limits of technology make him a standout figure in the world of inventors. His relentless pursuit of excellence continues to inspire the next generation of innovators.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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