The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 2024
Filed:
Feb. 22, 2022
Intel Corporation, Santa Clara, CA (US);
Eng Huat Goh, Ayer Itam, MY;
Jiun Hann Sir, Gelugor, MY;
Min Suet Lim, Bayan Lepas, MY;
Richard C. Stamey, Portland, OR (US);
Chu Aun Lim, Hillsboro, OR (US);
Jimin Yao, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A semiconductor package is disclosed, which comprises a substrate, one or more dies on a first side of the substrate, and a plurality of interconnect structures having a first pitch and coupled to a second side of the substrate. The interconnect structures may attach the substrate to a board. The substrate may include a first interconnect layer having a second pitch. The first interconnect layer may be coupled to the one or more dies through second one or more interconnect layers. Third one or more interconnect layers between the first interconnect layer and the interconnect structures may translate the first pitch to the second pitch. The substrate may include a recess on a section of the second side of the substrate. The semiconductor package may further include one or more components within the recess and attached to the second side of the substrate.