IDiyas

For the Inventor, By the Inventor

Gelugor, Malaysia

Jiun Hann Sir

USPTO Granted Patents = 32 

Average Co-Inventor Count = 3.1

ph-index = 4

Forward Citations = 96(Granted Patents)


Location History:

  • Penang, MY (2005 - 2019)
  • Gelugor, MY (2017 - 2024)

Company Filing History:

goldMedal32 out of 54,664 
 
Intel Corporation
 patents

Years Active: 2005-2025

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32 patents (USPTO):
1. 12400952 - Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge (2025-08-26),
2. 11929295 - Multi-use package architecture (2024-03-12),
3. 11908793 - Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge (2024-02-20),
4. 11823994 - Systems and apparatuses for implementing a pad on solder mask (POSM) semiconductor substrate package (2023-11-21),
5. 11699644 - Organic mold interconnects in shielded interconnects frames for integrated-circuit packages (2023-07-11),
6. 11658127 - RFI free picture frame metal stiffener (2023-05-23),
7. 11658111 - Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge (2023-05-23),
8. 11587844 - Electronic device package on package (POP) (2023-02-21),
9. 11538633 - Combination stiffener and capacitor (2022-12-27),
10. 11393760 - Floating-bridge interconnects and methods of assembling same (2022-07-19),
11. 11322434 - Top-to-bottom interconnects with molded lead-frame module for integrated-circuit packages (2022-05-03),
12. 11289414 - Systems, methods, and apparatuses for implementing a pad on solder mask (POSM) semiconductor substrate package (2022-03-29),
13. 11264315 - Electronic package with passive component between substrates (2022-03-01),
14. 11264160 - Extended package air core inductor (2022-03-01),
15. 11205613 - Organic mold interconnects in shielded interconnects frames for integrated-circuit packages (2021-12-21),

Title: Innovator Spotlight: Jiun Hann Sir

Introduction

Jiun Hann Sir is a prominent inventor located in Gelugor, Malaysia, holding an impressive portfolio of 31 patents. His contributions to semiconductor technology are noteworthy, showcasing his expertise and innovative spirit within the industry.

Latest Patents

Among Jiun Hann Sir's latest inventions is a cutting-edge multi-use package architecture, which presents a sophisticated semiconductor package comprising a substrate with one or more dies on one side and interconnect structures on the opposite side. This innovative design optimizes the attachment of the substrate to a board while adjusting pitch configurations for effective interconnectivity. Additionally, he has developed a technique for stripped redistribution-layer fabrication for an embedded multi-die interconnect bridge (EMIB). This method utilizes photolithographic techniques to position the EMIB strategically within the integrated-circuit package substrate, enhancing the functionality and real estate utilization in semiconductor designs.

Career Highlights

Jiun Hann Sir's career is highlighted by his affiliation with Intel Corporation, a leading name in semiconductor manufacturing. His focus on advancing packaging technologies has solidified his reputation as an influential figure in the field.

Collaborations

Throughout his career, Jiun has collaborated with talented professionals such as Eng Huat Goh and Min Suet Lim, contributing to a rich environment of innovation and sharing of ideas that drive the semiconductor industry forward.

Conclusion

Jiun Hann Sir continues to make significant strides in the realm of semiconductor technology with his inventive solutions and collaborative efforts. His dedication to innovation not only enhances the capabilities of Intel Corporation but also sets the bar for future developments in the industry.

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