The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2024
Filed:
Apr. 08, 2022
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Jiun Hann Sir, Gelugor, MY;
Poh Boon Khoo, Perai, MY;
Eng Huat Goh, Ayer Itam, MY;
Amruthavalli Pallavi Alur, Tempe, AZ (US);
Debendra Mallik, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5226 (2013.01); H01L 24/09 (2013.01); H01L 24/17 (2013.01); H01L 2224/02371 (2013.01); H01L 2224/02372 (2013.01); H01L 2924/01029 (2013.01);
Abstract
An embedded multi-die interconnect bridge (EMIB) is fabricated on a substrate using photolithographic techniques, and the EMIB is separated from the substrate and placed on the penultimate layer of an integrated-circuit package substrate, below the top solder-resist layer. A low Z-height of the EMIB, allows for useful trace and via real estate below the EMIB, to be employed in the package substrate.