Perai, Malaysia

Poh Boon Khoo

USPTO Granted Patents = 7 

Average Co-Inventor Count = 3.9

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2021-2025

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7 patents (USPTO):

Title: The Innovations of Poh Boon Khoo

Introduction

Poh Boon Khoo is a notable inventor based in Perai, Malaysia. He has made significant contributions to the field of integrated circuit packaging, holding a total of 7 patents. His work primarily focuses on advanced fabrication techniques that enhance the performance and efficiency of electronic devices.

Latest Patents

One of his latest patents is titled "Stripped Redistribution-Layer Fabrication for Package-Top Embedded Multi-Die Interconnect Bridge." This innovation involves the fabrication of an embedded multi-die interconnect bridge (EMIB) on a substrate using photolithographic techniques. The EMIB is strategically separated from the substrate and positioned on the penultimate layer of an integrated-circuit package substrate, located beneath the top solder-resist layer. The low Z-height of the EMIB allows for valuable trace and via real estate to be utilized below the EMIB within the package substrate.

Career Highlights

Poh Boon Khoo is currently employed at Intel Corporation, where he continues to push the boundaries of technology through his innovative work. His expertise in integrated circuit packaging has made him a valuable asset to the company and the industry as a whole.

Collaborations

Poh has collaborated with several talented individuals, including Jiun Hann Sir and Eng Huat Goh, who contribute to the dynamic environment of innovation at Intel Corporation.

Conclusion

Poh Boon Khoo's contributions to the field of integrated circuit packaging exemplify the spirit of innovation. His patents and collaborative efforts continue to shape the future of technology in significant ways.

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