The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2026
Filed:
Dec. 03, 2021
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01); H01L 25/18 (2023.01);
U.S. Cl.
CPC ...
H01L 24/05 (2013.01); H01L 25/0657 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 2224/05017 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/06582 (2013.01); H01L 2225/06589 (2013.01);
Abstract
Methods and apparatus to reduce thickness of on-package memory architectures are disclosed. An on-package memory architecture includes a memory die; a bonding pad including a first surface and a second surface opposite the first surface; a wire bond electrically coupling the memory die to the first surface of the bonding pad; and a metal stub protruding from the second surface of the bonding pad. The metal stub is to electrically couple with a contact pad on a package substrate of an integrated circuit (IC) package.