The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2026

Filed:

Jun. 07, 2022
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Min Suet Lim, Gelugor, MY;

Tin Poay Chuah, Bayan Baru, MY;

Yew San Lim, Gelugor, MY;

Jeff Ku, Taipei City, TW;

Twan Sing Loo, Butterworth, MY;

Poh Boon Khoo, Perai, MY;

Jiun Hann Sir, Gelugor, MY;

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/181 (2026.01); H05K 3/22 (2006.01); H10W 40/22 (2026.01); H10W 40/70 (2026.01); H10W 72/00 (2026.01); H10W 74/15 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H05K 1/0204 (2013.01); H05K 3/22 (2013.01); H10W 40/22 (2026.01); H10W 40/70 (2026.01); H10W 90/00 (2026.01); H05K 1/181 (2013.01); H05K 2201/066 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10409 (2013.01); H05K 2201/10515 (2013.01); H05K 2201/1053 (2013.01); H05K 2201/1056 (2013.01); H05K 2203/0195 (2013.01); H10W 72/073 (2026.01); H10W 72/877 (2026.01); H10W 74/15 (2026.01); H10W 90/724 (2026.01); H10W 90/734 (2026.01);
Abstract

Embodiments disclosed herein include a printed circuit board (PCB). In an embodiment, the PCB comprises a substrate with a first surface and a second surface opposite from the first surface. In an embodiment, a first slot is through a thickness of the substrate, and a second slot is through the thickness of the substrate, where the first slot is parallel to the second slot. In an embodiment, a metal plate is provided on the PCB. In an embodiment the metal plate comprises a first portion over the first surface of the substrate between the first slot and the second slot, a second portion connected to the first portion, wherein the second portion is in the first slot, and a third portion connected to the first portion, wherein the third portion is in the second slot.


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