Richard Christopher Stamey

Title: The Innovations of Richard Christopher Stamey

Introduction

Richard Christopher Stamey, an inventive force based in Portland, OR, has made significant contributions to the field of semiconductor packaging. With an impressive portfolio of 10 patents, Stamey has developed groundbreaking technologies that continue to shape the industry.

Latest Patents

Stamey's most recent innovations include the *Multi-use package architecture*, which presents a sophisticated semiconductor package featuring a substrate with one or more dies and multiple interconnect structures. This unique design allows for the attachment of the substrate to a board while accommodating various interconnect pitches. Additionally, his patent on *Hybrid microelectronic substrates* details a combination of low-density and high-density microelectronic substrates, showcasing advanced fabrication techniques to enhance electrical performance.

Career Highlights

Stamey is currently affiliated with Intel Corporation, one of the leading technology companies worldwide. His role at Intel has positioned him at the forefront of semiconductor research, allowing him to innovate in areas that are critical to modern electronic devices and systems.

Collaborations

While working at Intel, Stamey has had the pleasure of collaborating with talented engineers and inventors, including Robert Starkston and Robert L. Sankman. These partnerships have enabled him to influence and enhance various projects, leading to remarkable advancements in semiconductor technologies.

Conclusion

Richard Christopher Stamey's contributions to the semiconductor industry exemplify the spirit of innovation. Through his patents and collaborations, he continually advances the frontiers of technology, solidifying his position as a key inventor in the realm of microelectronics. His work not only reflects his expertise but also serves as an inspiration to future inventors and industry professionals.