The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2024
Filed:
Aug. 19, 2021
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Robert Starkston, Phoenix, AZ (US);
Robert L. Sankman, Phoenix, AZ (US);
Scott M. Mokler, Hillsboro, OR (US);
Richard Christopher Stamey, Portland, OR (US);
Amruthavalli Pallavi Alur, Tempe, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/13 (2006.01); H01L 23/485 (2006.01); H01L 23/488 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 23/13 (2013.01); H01L 23/485 (2013.01); H01L 23/488 (2013.01); H01L 23/49816 (2013.01); H01L 23/5383 (2013.01); H01L 23/5385 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/15311 (2013.01);
Abstract
Hybrid microelectronic substrates, and related devices and methods, are disclosed herein. In some embodiments, a hybrid microelectronic substrate may include a low-density microelectronic substrate having a recess at a first surface, and a high-density microelectronic substrate disposed in the recess and coupled to a bottom of the recess via solder.