The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 20, 2018

Filed:

Feb. 16, 2016
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Kevin E. Wells, Placerville, CA (US);

Richard C. Stamey, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 7/02 (2006.01); H05K 1/02 (2006.01); H05K 3/36 (2006.01); H05K 3/42 (2006.01); G06F 1/16 (2006.01); H05K 3/34 (2006.01); H05K 1/14 (2006.01); G06F 1/18 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); G06F 1/16 (2013.01); G06F 1/18 (2013.01); G06F 1/183 (2013.01); H01L 23/49833 (2013.01); H05K 1/141 (2013.01); H05K 3/3436 (2013.01); H05K 3/421 (2013.01); H01L 2924/0002 (2013.01); H05K 2201/041 (2013.01); H05K 2201/10719 (2013.01); Y02P 70/613 (2015.11); Y10T 29/49128 (2015.01);
Abstract

Modular printed circuit board (PCB) structures and methods of producing them are described herein. In some embodiments, a PCB structure may include a first PCB module including first structures on one or more layers of the first PCB module. The PCB structure may further include a second PCB module including second structures on one or more layers of the second PCB module. The PCB structure may additionally include a middle layer between the first PCB module and the second PCB module. The middle layer electrically coupling, without connectors, one or more of the first structures aligned with one or more of the second structures.


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