The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 2023
Filed:
Mar. 25, 2019
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Jimin Yao, Chandler, AZ (US);
Shawna Liff, Scottsdale, AZ (US);
Xin Yan, Chandler, AZ (US);
Numair Ahmed, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/17 (2013.01); H01L 24/13 (2013.01); H01L 24/81 (2013.01); H01L 2224/13014 (2013.01); H01L 2224/1319 (2013.01); H01L 2224/1357 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13647 (2013.01); H01L 2224/13655 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/14505 (2013.01); H01L 2224/171 (2013.01); H01L 2224/812 (2013.01); H01L 2224/81139 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/014 (2013.01);
Abstract
Embodiments herein relate to systems, apparatuses, or processes directed to an interconnect joint that includes multiple core balls within a solder compound where the multiple core balls are substantially linearly aligned. The multiple core balls, which may include copper or be a polymer, couple with each other within the solder and form a substantially linear alignment during reflow. In embodiments, four or more core balls may be used to achieve a high aspect ratio interconnect joint with a tight pitch.