The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 09, 2024

Filed:

Mar. 25, 2022
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Jimin Yao, Chandler, AZ (US);

Robert L. Sankman, Phoenix, AZ (US);

Shawna M. Liff, Scottsdale, AZ (US);

Sri Chaitra Jyotsna Chavali, Chandler, AZ (US);

William J. Lambert, Chandler, AZ (US);

Zhichao Zhang, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 9/04 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01);
U.S. Cl.
CPC ...
H01Q 9/0414 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/563 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 23/66 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6677 (2013.01);
Abstract

In accordance with disclosed embodiments, there is an antenna package using a ball attach array to connect an antenna and base substrates of the package. One example is an RF module package including an RF antenna package having a stack material in between a top and a bottom antenna layer to form multiple antenna plane surfaces, a base package having alternating patterned conductive and dielectric layers to form routing through the base package, and a bond between a bottom surface of the antenna package and to a top surface of the base package.


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