IDiyas

For the Inventor, By the Inventor

Chandler, AZ, United States of America

Sri Chaitra Jyotsna Chavali

USPTO Granted Patents = 26 

Average Co-Inventor Count = 3.1

ph-index = 3

Forward Citations = 44(Granted Patents)


Company Filing History:

goldMedal26 out of 54,664 
 
Intel Corporation
 patents

Years Active: 2018-2025

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26 patents (USPTO):
1. 12334242 - Coreless electronic substrates having embedded inductors (2025-06-17),
2. 12261124 - Embedded die architecture and method of making (2025-03-25),
3. 12132015 - Package embedded magnetic inductor structures and manufacturing techniques for 5-50 MHZ SMPS operations (2024-10-29),
4. 12062551 - High density organic interconnect structures (2024-08-13),
5. 12033930 - Selectively roughened copper architectures for low insertion loss conductive features (2024-07-09),
6. 11870163 - Antenna package using ball attach array to connect antenna and base substrates (2024-01-09),
7. 11869842 - Scalable high speed high bandwidth IO signaling package architecture and method of making (2024-01-09),
8. 11804426 - Integrated circuit structures in package substrates (2023-10-31),
9. 11764150 - Inductors for package substrates (2023-09-19),
10. 11721632 - Hybrid core substrate architecture for high speed signaling and FLI/SLI reliability and its making (2023-08-08),
11. 11664313 - Microelectronic device including fiber-containing build-up layers (2023-05-30),
12. 11631595 - High density organic interconnect structures (2023-04-18),
13. 11276634 - High density package substrate formed with dielectric bi-layer (2022-03-15),
14. 11195727 - High density organic interconnect structures (2021-12-07),
15. 11107757 - Integrated circuit structures in package substrates (2021-08-31),

Title: Sri Chaitra Jyotsna Chavali: Innovator in Semiconductor Packaging

Introduction

Sri Chaitra Jyotsna Chavali is a prominent inventor based in Chandler, Arizona, specializing in the field of semiconductor packaging. With an impressive portfolio of 25 patents, Chaitra has made significant contributions to innovations in semiconductors, displaying a keen ability to enhance technology in this area.

Latest Patents

Chaitra's latest patents showcase advanced concepts in semiconductor packaging. One notable invention is the "Embedded die architecture and method of making." This patent provides a comprehensive description of a semiconductor package that includes a substrate with substantially planar surfaces and a bridge die that provides innovative connectivity. The design also integrates a through silicon via and an overmold, aimed at encapsulating vital electronic components.

Another significant patent involves "Package embedded magnetic inductor structures and manufacturing techniques for 5-50 MHz SMPS operations." This patent outlines the design of inductors that include a substrate surrounding a magnetic layer, enhancing efficiency in power supply operations. The design features a dielectric layer that fully encapsulates both the substrate and magnetic layers, along with conductive layers and plated-through-hole vias, ensuring effective electronic performance.

Career Highlights

Chaitra currently works at Intel Corporation, a leading company in semiconductor technology. His role has allowed him to pioneer several groundbreaking patents, further establishing his reputation as an innovator in the field. His contributions not only enhance Intel's product offerings but also push the boundaries of semiconductor capabilities.

Collaborations

Throughout his career, Chaitra has collaborated with notable colleagues such as Siddharth K Alur and Sanka Ganesan. These partnerships highlight the collaborative nature of innovation in technology, where teamwork is essential to achieving groundbreaking advancements.

Conclusion

In summary, Sri Chaitra Jyotsna Chavali stands out as a leading inventor in the semiconductor industry. With a strong track record of patent contributions and innovative collaborations at Intel Corporation, his work is instrumental in driving advancements in semiconductor packaging and technology. As the field continues to evolve, Chaitra's contributions will likely play a crucial role in shaping the future of the industry.

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