The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2026
Filed:
Apr. 01, 2022
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Brandon Christian Marin, Gilbert, AZ (US);
Hamid R. Azimi, Paradise Valley, AZ (US);
Sri Chaitra Jyotsna Chavali, Gilbert, AZ (US);
Tarek A. Ibrahim, Mesa, AZ (US);
Wei-Lun K Jen, Phoenix, AZ (US);
Rahul Manepalli, Chandler, AZ (US);
Kevin T. Mccarthy, Tempe, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 70/69 (2026.01); H10W 70/63 (2026.01); H10W 70/685 (2026.01);
U.S. Cl.
CPC ...
H10W 70/69 (2026.01); H10W 70/635 (2026.01); H10W 70/685 (2026.01);
Abstract
In one embodiment, a package substrate includes a substrate core, buildup layers, and one or more conductive traces. The substrate core includes at least one dielectric layer with hollow glass fibers. The buildup layers include dielectric layers below and above the substrate core.