IDiyas

For the Inventor, By the Inventor

Chandler, AZ, United States of America

Hamid Azimi

USPTO Granted Patents = 17 

Average Co-Inventor Count = 3.4

ph-index = 7

Forward Citations = 128(Granted Patents)


Company Filing History:

goldMedal17 out of 54,664 
 
Intel Corporation
 patents

Years Active: 2002-2019

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17 patents (USPTO):Explore Patents
1. 10306760 - Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method (2019-05-28),
2. 9648733 - Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method (2017-05-09),
3. 9312233 - Method of forming molded panel embedded die structure (2016-04-12),
4. 9257380 - Forming functionalized carrier structures with coreless packages (2016-02-09),
5. 8987065 - Forming functionalized carrier structures with coreless packages (2015-03-24),
6. 8618652 - Forming functionalized carrier structures with coreless packages (2013-12-31),
7. 8440916 - Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method (2013-05-14),
8. 8035218 - Microelectronic package and method of manufacturing same (2011-10-11),
9. 7985622 - Method of forming collapse chip connection bumps on a semiconductor substrate (2011-07-26),
10. 7413936 - Method of forming copper layers (2008-08-19),
11. 7330357 - Integrated circuit die/package interconnect (2008-02-12),
12. 7042077 - Integrated circuit package with low modulus layer and capacitor/interposer (2006-05-09),
13. 7005727 - Low cost programmable CPU package/substrate (2006-02-28),
14. 6858475 - Method of forming an integrated circuit substrate (2005-02-22),
15. 6600233 - Integrated circuit package with surface mounted pins on an organic substrate (2003-07-29),

Title: The Innovative Contributions of Hamid Azimi

Introduction

Hamid Azimi is a prominent inventor based in Chandler, Arizona. He has made significant contributions to the field of substrate core structures, holding a total of 17 patents. His work focuses on advanced methods of fabrication that enhance the efficiency and effectiveness of electronic components.

Latest Patents

One of Hamid Azimi's latest patents is a method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning. This innovative method involves several steps, including providing patterned conductive layers, laser drilling via openings, and filling these openings with conductive material to create conductive vias. The process culminates in the application of supplemental patterned conductive layers, ensuring that the conductive vias make contact with these layers, thereby enhancing the overall functionality of the substrate core structure.

Career Highlights

Hamid Azimi is currently employed at Intel Corporation, where he continues to push the boundaries of technology through his inventive work. His career at Intel has been marked by a commitment to innovation and excellence in the field of electronics.

Collaborations

Throughout his career, Hamid has collaborated with notable colleagues, including John Stephen Guzek and Charan K Gurumurthy. These collaborations have further enriched his work and contributed to the advancement of technology in their respective fields.

Conclusion

Hamid Azimi's contributions to the field of substrate core structures exemplify the spirit of innovation. His patents and work at Intel Corporation highlight his dedication to advancing technology and improving electronic components.

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