Package embedded magnetic inductor structures and manufacturing techniques for 5-50 mhz smps operations

Abstract

Embodiments include inductors and methods to form the inductors. An inductor includes a substrate layer that surrounds a magnetic layer, where the magnetic layer is embedded between the substrate layer. The inductor also includes a dielectric layer that surrounds the substrate and magnetic layers, where the dielectric layer fully embeds the substrate and magnetic layers. The inductor further includes a first conductive layer over the dielectric layer, a second conductive layer below the dielectric layer, and a plurality of plated-through-hole (PTH) vias in the dielectric and substrate layers. The PTH vias vertically extend from the first conductive layer to the second conductive layer, and the magnetic layer in between the PTH vias. The magnetic layer may have a thickness that is substantially equal to a thickness of the substrate layer, where the thickness of the magnetic layer is less than a thickness defined between the first and second conductive layers.