Intel Corporation

Stephen Smith

Zhichao Zhang

Robert L Sankman

Kemal Aygun

Omkar G Karhade

Pooya Tadayon

Brandon C Marin

Tarek A Ibrahim

Jimin Yao

Xiaoqian Li

Zhenguo Jiang

Srichaitra Chavali

Integrated circuit packages may be formed having at least one optical via extending from a first surface of a package substrate to an opposing second surface of the package substrate. The at least one optical via creates an optical link between the opposing surfaces of the package substrate that enables the fabrication of a dual-sided optical multiple chip package, wherein integrated circuit devices can be attached to both surfaces of the package substrate for increased package density.

Through-substrate optical vias

An RF chip package comprises a housing and one or more conductive contacts designed to electrically connect the RF chip package to other conductive contacts. The housing includes a first substrate, a 3-D antenna on the first substrate, and a second substrate. The second substrate includes a plurality of semiconductor devices and is bonded to the first substrate. An interconnect structure allows for electrical connection between the first and second substrates. In some cases, the first substrate is flip-chip bonded to the second substrate or is otherwise connected to the second substrate by an array of solder balls. By integrating both the 3-D antenna and RF circuitry together in the same chip package, costs are minimized while bandwidth is greatly improved compared to a separately machined 3-D antenna.

In-package 3D antenna

Growing community of inventors

Laveen, AZ, United States of America

Stephen Smith