The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2026
Filed:
Oct. 03, 2022
Intel Corporation, Santa Clara, CA (US);
Kristof Kuwawi Darmawikarta, Chandler, AZ (US);
Cemil S. Geyik, Gilbert, AZ (US);
Kemal Aygun, Tempe, AZ (US);
Tarek A. Ibrahim, Mesa, AZ (US);
Wei-Lun Jen, Phoenix, AZ (US);
Zhiguo Qian, Chandler, AZ (US);
Dilan Seneviratne, Phoenix, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Embodiments of a microelectronic assembly that includes: a package substrate, comprising buildup layers of an organic dielectric material and a plurality of layers of conductive traces in the organic dielectric material, the package substrate having a first surface and a second surface opposite the first surface; and a plurality of integrated circuit (IC) dies coupled to the package substrate on the first side. The plurality of layers of conductive traces comprises a pair of stripline traces or microstrips in one of the layers, the stripline traces or microstrips are surrounded by air gap structures in the organic dielectric material, and the air gap structures are exposed on the first surface.