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For the Inventor, By the Inventor

Chandler, AZ, United States of America

Dilan Seneviratne

USPTO Granted Patents = 39 

 

Average Co-Inventor Count = 4.4

ph-index = 2

Forward Citations = 23(Granted Patents)


Location History:

  • Phoenix, AZ (US) (2016 - 2023)
  • Chandler, AZ (US) (2011 - 2024)

Company Filing History:

goldMedal39 out of 54,664 
 
Intel Corporation
 patents

Years Active: 2011-2025

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39 patents (USPTO):
1. 12442979 - Optical waveguide formed within in a glass layer (2025-10-14),
2. 12087700 - Embedded die microelectronic device with molded component (2024-09-10),
3. 11942406 - Semiconductor packages with embedded interconnects (2024-03-26),
4. 11935857 - Surface finishes with low RBTV for fine and mixed bump pitch architectures (2024-03-19),
5. 11780210 - Glass dielectric layer with patterning (2023-10-10),
6. 11737208 - Microelectronic assemblies having conductive structures with different thicknesses (2023-08-22),
7. 11728265 - Selective deposition of embedded thin-film resistors for semiconductor packaging (2023-08-15),
8. 11670504 - Ultra-thin dielectric films using photo up-conversion for applications in substrate manufacturing and integrating passives (2023-06-06),
9. 11637171 - Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same (2023-04-25),
10. 11605867 - Fabricating an RF filter on a semiconductor package using selective seeding (2023-03-14),
11. 11571876 - Dielectric film with pressure sensitive microcapsules of adhesion promoter (2023-02-07),
12. 11488918 - Surface finishes with low rBTV for fine and mixed bump pitch architectures (2022-11-01),
13. 11393745 - Semiconductor packages with embedded interconnects (2022-07-19),
14. 11296186 - Package-integrated vertical capacitors and methods of assembling same (2022-04-05),
15. 11081768 - Fabricating an RF filter on a semiconductor package using selective seeding (2021-08-03),

Sure, I can help you with that. Here is the article about inventor Dilan Seneviratne based on the given data:

Title: Innovator Spotlight: Dilan Seneviratne

Introduction:

Dilan Seneviratne, a prolific inventor based in Chandler, AZ, has made significant contributions to the field of semiconductor packaging with his impressive portfolio of 37 patents. His innovative work in the industry has garnered widespread recognition and praise.

Latest Patents:

Seneviratne's recent patents include groundbreaking technologies such as "Semiconductor Packages with Embedded Interconnects" and "Surface Finishes with Low RBTV for Fine and Mixed Bump Pitch Architectures." These patents showcase his expertise in developing advanced electronic packages and methods that push the boundaries of current technology.

Career Highlights:

Having worked at renowned companies like Intel Corporation, Seneviratne has accumulated a wealth of experience in the semiconductor industry. His tenure at Intel Corporation has been marked by numerous successful projects and innovations that have had a lasting impact on the field.

Collaborations:

Throughout his career, Seneviratne has collaborated with esteemed professionals in the industry, including colleagues such as Aleksandar Aleksov and Srinivas V Pietambaram. These collaborations have led to the development of cutting-edge technologies and solutions that have enhanced the performance and reliability of electronic packages.

Conclusion:

In conclusion, Dilan Seneviratne is a visionary inventor whose relentless pursuit of innovation has positioned him as a key player in the semiconductor industry. His remarkable patents and successful career at top-tier companies underscore his dedication to advancing technology and shaping the future of electronic packaging. Seneviratne's contributions continue to inspire and drive progress in the field, making him a truly exceptional innovator.

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