The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2026
Filed:
Jul. 01, 2022
Intel Corporation, Santa Clara, CA (US);
Jieying Kong, Chandler, AZ (US);
Peumie Abeyratne Kuragama, Chandler, AZ (US);
Ala Omer, Phoenix, AZ (US);
Ao Wang, Chandler, AZ (US);
Dilan Seneviratne, Phoenix, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Microelectronic integrated circuit package structures include a first layer over a substrate, the first layer having a matrix material and a filler material within the matrix material. A second layer is on the first layer, the second layer comprising the matrix material or a second material, where the filler material is substantially absent from the second layer. A first portion of a conductive feature is on the second layer and a second portion of the conductive feature is on a sidewall of the first layer.