The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2026

Filed:

Sep. 22, 2021
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Dilan Seneviratne, Chandler, AZ (US);

Whitney Bryks, Tempe, AZ (US);

Ala Omer, Phoenix, AZ (US);

Jieying Kong, Chandler, AZ (US);

Sarah Blythe, Phoenix, AZ (US);

Bainye Francoise Angoua, Phoenix, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); G02B 6/12 (2006.01);
U.S. Cl.
CPC ...
G02B 6/4203 (2013.01); G02B 6/12 (2013.01); G02B 2006/12061 (2013.01); G02B 2006/12147 (2013.01); G02B 2006/12171 (2013.01);
Abstract

Embodiments described herein may be related to apparatuses, processes, and techniques directed to dense integration of PICs in a substrate using an optical fanout structure that includes waveguides formed within a substrate to optically couple with the PICs at an edge of the substrate. One or more PICs may then be electrically with dies such as processor dies or memory dies. The one or more PICs may be located within a cavity in the substrate. The substrate may be made of glass or silicon. Other embodiments may be described and/or claimed.


Find Patent Forward Citations

Loading…