The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 2023
Filed:
Jul. 21, 2020
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Shivasubramanian Balasubramanian, Gilbert, AZ (US);
Dilan Seneviratne, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 49/02 (2006.01); H01L 23/498 (2006.01); H01L 23/522 (2006.01); H01L 27/08 (2006.01);
U.S. Cl.
CPC ...
H01L 28/10 (2013.01); H01L 23/49811 (2013.01); H01L 23/5227 (2013.01); H01L 27/08 (2013.01);
Abstract
A semiconductor package substrate includes an integral magnetic-helical inductor that is assembled during assembly of the semiconductor package substrate. The integral magnetic-helical inductor is located within a die footprint within the semiconductor package substrate.