The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 2024
Filed:
Aug. 02, 2021
Intel Corporation, Santa Clara, CA (US);
Srinivas Venkata Ramanuja Pietambaram, Chandler, AZ (US);
Rahul N. Manepalli, Chandler, AZ (US);
Praneeth Akkinepally, Tempe, AZ (US);
Jesse C. Jones, Chandler, AZ (US);
Yosuke Kanaoka, Phoenix, AZ (US);
Dilan Seneviratne, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Microelectronic devices including an embedded die substrate including a molded component formed on or over a surface of a laminated substrate that provides a planar outer surface independent of the contour of the adjacent laminated substrate surface. The molded component may be formed over at least a portion of the embedded die. In other examples, the molded component and resulting planar outer surface may alternatively be on the backside of the substrate, away from the embedded die. The molded component may include an epoxy mold compound; and may be formed through processes including compression molding and transfer molding.