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For the Inventor, By the Inventor

Tempe, AZ, United States of America

Praneeth Kumar Akkinepally

USPTO Granted Patents = 17 

Average Co-Inventor Count = 3.3

ph-index = 1

Forward Citations = 3(Granted Patents)


Location History:

  • Chandler, AZ (US) (2018 - 2023)
  • Tempe, AZ (US) (2022 - 2024)

Company Filing History:

goldMedal17 out of 54,664 
 
Intel Corporation
 patents

Years Active: 2018-2025

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17 patents (USPTO):
1. 12394682 - Organic passivation for fine pitch architectures (2025-08-19),
2. 12087700 - Embedded die microelectronic device with molded component (2024-09-10),
3. 11737208 - Microelectronic assemblies having conductive structures with different thicknesses (2023-08-22),
4. 11688692 - Embedded multi-die interconnect bridge having a substrate with conductive pathways and a molded material region with through-mold vias (2023-06-27),
5. 11652071 - Electronic device package including a capacitor (2023-05-16),
6. 11574874 - Package architecture utilizing photoimageable dielectric (PID) for reduced bump pitch (2023-02-07),
7. 11571876 - Dielectric film with pressure sensitive microcapsules of adhesion promoter (2023-02-07),
8. 11462432 - Dual side de-bonding in component carriers using photoablation (2022-10-04),
9. 11348865 - Electronic device including a substrate having interconnects (2022-05-31),
10. 11296186 - Package-integrated vertical capacitors and methods of assembling same (2022-04-05),
11. 11233009 - Embedded multi-die interconnect bridge having a molded region with through-mold vias (2022-01-25),
12. 11081448 - Embedded die microelectronic device with molded component (2021-08-03),
13. 10985080 - Electronic package that includes lamination layer (2021-04-20),
14. 10923443 - Electronic device package including a capacitor (2021-02-16),
15. 10546916 - Package-integrated vertical capacitors and methods of assembling same (2020-01-28),

Sure, here is the article about inventor Praneeth Kumar Akkinepally:

Title: Innovator Spotlight: Praneeth Kumar Akkinepally

Introduction: Praneeth Kumar Akkinepally is an accomplished inventor based in Tempe, AZ, with a remarkable portfolio of 15 patents to his name. His groundbreaking work in the field of microelectronic assemblies has garnered widespread recognition in the industry.

Latest Patents: Praneeth's latest patents include "Microelectronic assemblies having conductive structures with different thicknesses" and "Embedded multi-die interconnect bridge having a substrate with conductive pathways and a molded material region with through-mold vias." These inventions showcase his expertise in developing cutting-edge technologies for microelectronic devices.

Career Highlights: Praneeth Kumar Akkinepally is a valued member of the innovation team at Intel Corporation, a global leader in semiconductor manufacturing. His contributions have significantly advanced the company's research and development efforts, positioning them at the forefront of technological innovation.

Collaborations: Praneeth has collaborated with esteemed colleagues such as Frank Truong and Dilan Seneviratne, who have played a pivotal role in bringing his innovative ideas to life. Their combined expertise and collaborative spirit have led to the successful implementation of groundbreaking technologies in the field of microelectronics.

Conclusion: In conclusion, Praneeth Kumar Akkinepally's dedication to innovation and his exceptional talent as an inventor have solidified his reputation as a trailblazer in the world of microelectronics. His impressive portfolio of patents and his influential work at Intel Corporation underscore his ongoing commitment to pushing the boundaries of technological advancement.

I hope you find this article insightful and engaging! If you have any further questions or need more information, feel free to ask.

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