The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 07, 2023
Filed:
Mar. 17, 2017
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Praneeth Akkinepally, Chandler, AZ (US);
Frank Truong, Gilbert, AZ (US);
Dilan Seneviratne, Phoenix, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/36 (2006.01); B32B 7/12 (2006.01); B32B 15/20 (2006.01); C09J 7/29 (2018.01); C09J 7/40 (2018.01); C09J 11/00 (2006.01); C08K 5/17 (2006.01); C08K 5/37 (2006.01); C09J 7/25 (2018.01);
U.S. Cl.
CPC ...
B32B 7/12 (2013.01); B32B 15/20 (2013.01); B32B 27/36 (2013.01); C08K 5/17 (2013.01); C08K 5/37 (2013.01); C09J 7/255 (2018.01); C09J 7/29 (2018.01); C09J 7/40 (2018.01); C09J 11/00 (2013.01); B32B 2250/03 (2013.01); B32B 2264/102 (2013.01); B32B 2307/204 (2013.01); B32B 2309/12 (2013.01); B32B 2311/12 (2013.01); B32B 2398/00 (2013.01); B32B 2457/00 (2013.01); C09J 2301/122 (2020.08); C09J 2301/408 (2020.08); C09J 2301/41 (2020.08); C09J 2301/412 (2020.08); C09J 2467/006 (2013.01);
Abstract
Embodiments are generally directed to dielectric film with pressure sensitive microcapsules of adhesion promoter. An embodiment of an apparatus includes a dielectric film, the dielectric film including a dielectric material layer; a layer of pressure sensitive microcapsules on a first side of the dielectric material layer, the microcapsules including an adhesion promoter; and a cover material on the layer of microcapsules. The pressure sensitive microcapsules are to rupture upon application of a certain rupture pressure.