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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11571876 B1

PDFFull Text
Date of Patent:
Feb. 07, 2023

Filed:

Mar. 17, 2017

Dielectric film with pressure sensitive microcapsules of adhesion promoter

Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Praneeth Akkinepally, Chandler, AZ (US);

Frank Truong, Gilbert, AZ (US);

Dilan Seneviratne, Phoenix, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:

Schwabe, Williamson & Wyatt, P.C.

Primary Examiner:

Frank D Ducheneaux

Int. Cl.
CPC ...
B32B 27/36 (2006.01); B32B 7/12 (2006.01); B32B 15/20 (2006.01); C09J 7/29 (2018.01); C09J 7/40 (2018.01); C09J 11/00 (2006.01); C08K 5/17 (2006.01); C08K 5/37 (2006.01); C09J 7/25 (2018.01);
U.S. Cl.
CPC ...
B32B 7/12 (2013.01); B32B 15/20 (2013.01); B32B 27/36 (2013.01); C08K 5/17 (2013.01); C08K 5/37 (2013.01); C09J 7/255 (2018.01); C09J 7/29 (2018.01); C09J 7/40 (2018.01); C09J 11/00 (2013.01); B32B 2250/03 (2013.01); B32B 2264/102 (2013.01); B32B 2307/204 (2013.01); B32B 2309/12 (2013.01); B32B 2311/12 (2013.01); B32B 2398/00 (2013.01); B32B 2457/00 (2013.01); C09J 2301/122 (2020.08); C09J 2301/408 (2020.08); C09J 2301/41 (2020.08); C09J 2301/412 (2020.08); C09J 2467/006 (2013.01);
Abstract

Embodiments are generally directed to dielectric film with pressure sensitive microcapsules of adhesion promoter. An embodiment of an apparatus includes a dielectric film, the dielectric film including a dielectric material layer; a layer of pressure sensitive microcapsules on a first side of the dielectric material layer, the microcapsules including an adhesion promoter; and a cover material on the layer of microcapsules. The pressure sensitive microcapsules are to rupture upon application of a certain rupture pressure.

Find Patent Forward Citations

Akkinepally, Praneeth. (2023). Dielectric film with pressure sensitive microcapsules of adhesion promoter (U.S. Patent No. 11571876). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11571876

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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