The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 2025
Filed:
Sep. 10, 2021
Intel Corporation, Santa Clara, CA (US);
Praneeth Kumar Akkinepally, Tempe, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
An integrated circuit (IC) package includes a package substrate, a first die over the package substrate, a stack of a first material and a second material over the first die, where the first material is between the first die and the second material and the second material includes an organic passivation material, interconnect structures including vias on the first die and extending through the first and second materials and conductive bumps on the second material, and a second die over the first die and connected to the first die via the interconnect structures, where a taper angle between an inner portion of a side wall of one of the vias and a plane parallel to a bottom opening of the one of the vias is less than or equal to 90 degrees.