The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2023
Filed:
May. 22, 2019
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Jeremy D. Ecton, Gilbert, AZ (US);
Brandon C. Marin, Chandler, AZ (US);
Andrew J. Brown, Phoenix, AZ (US);
Dilan Seneviratne, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 23/532 (2006.01); H01L 21/768 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02345 (2013.01); H01L 21/02118 (2013.01); H01L 21/02167 (2013.01); H01L 21/02194 (2013.01); H01L 21/76825 (2013.01); H01L 21/76841 (2013.01); H01L 23/5329 (2013.01); H01L 23/53228 (2013.01); H01L 28/60 (2013.01);
Abstract
A thin-film insulator comprises a first electrode over a substrate. A photo up-converting material is over the first electrode. A cured photo-imageable dielectric (PID) containing a high-k filler material is over the photo up-converting material, wherein the cured PID is less than 4 μm in thickness, and a second electrode is over the cured PID.
Ecton, Jeremy. (2023). Ultra-thin dielectric films using photo up-conversion for applications in substrate manufacturing and integrating passives (U.S. Patent No. 11670504). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11670504
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile