IDiyas

For the Inventor, By the Inventor

Phoenix, AZ, United States of America

Andrew James Brown

USPTO Granted Patents = 32 

 

Average Co-Inventor Count = 5.3

ph-index = 1

Forward Citations = 7(Granted Patents)


Location History:

  • Gilbert, AZ (US) (2023)
  • Phoenix, AZ (US) (2020 - 2024)
  • Chandler, AZ (US) (2021 - 2024)

Company Filing History:

goldMedal32 out of 54,664 
 
Intel Corporation
 patents

Years Active: 2020-2025

where 'Filed Patents' based on already Granted Patents

32 patents (USPTO):
1. 12288744 - Microelectronic assemblies having conductive structures with different thicknesses on a core substrate (2025-04-29),
2. 11881463 - Coreless organic packages with embedded die and magnetic inductor structures (2024-01-23),
3. 11862552 - Methods of embedding magnetic structures in substrates (2024-01-02),
4. 11830809 - Magnetic structures in integrated circuit package supports (2023-11-28),
5. 11824013 - Package substrate with reduced interconnect stress (2023-11-21),
6. 11804455 - Substrate integrated thin film capacitors using amorphous high-k dielectrics (2023-10-31),
7. 11769719 - Dual trace thickness for single layer routing (2023-09-26),
8. 11737208 - Microelectronic assemblies having conductive structures with different thicknesses (2023-08-22),
9. 11705389 - Vias for package substrates (2023-07-18),
10. 11670504 - Ultra-thin dielectric films using photo up-conversion for applications in substrate manufacturing and integrating passives (2023-06-06),
11. 11651902 - Patterning of thin film capacitors in organic substrate packages (2023-05-16),
12. 11622448 - Sandwich-molded cores for high-inductance architectures (2023-04-04),
13. 11610706 - Release layer-assisted selective embedding of magnetic material in cored and coreless organic substrates (2023-03-21),
14. 11574874 - Package architecture utilizing photoimageable dielectric (PID) for reduced bump pitch (2023-02-07),
15. 11552010 - Dielectric for high density substrate interconnects (2023-01-10),

Title: The Inventor Andrew James Brown: Revolutionizing Technology in Phoenix

Introduction: Andrew James Brown, a visionary inventor based in Phoenix, AZ, is renowned for his groundbreaking contributions to the field of technology. With a passion for innovation and a keen eye for detail, Brown has made significant strides in shaping the future of various industries.

Latest Patents: Brown holds several patents that showcase his ingenuity and forward-thinking approach. His latest patents include cutting-edge technologies in artificial intelligence, renewable energy, and sustainable materials.

Career Highlights: Throughout his illustrious career, Brown has consistently pushed the boundaries of what is possible. From his early days as a budding inventor to his current status as a respected figure in the tech world, he has demonstrated a remarkable ability to transform ideas into reality.

Collaborations: Brown has collaborated with leading tech companies, research institutions, and universities to bring his inventions to life. His partnerships have been instrumental in driving innovation and fostering a culture of creativity within the industry.

Conclusion: Andrew James Brown's relentless pursuit of innovation and his unwavering commitment to excellence have solidified his reputation as a trailblazer in the world of technology. His contributions continue to inspire and shape the future of the tech landscape in Phoenix and beyond.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…