The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2023

Filed:

Jun. 29, 2018
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Rahul Jain, Gilbert, AZ (US);

Andrew J. Brown, Phoenix, AZ (US);

Prithwish Chatterjee, Tempe, AZ (US);

Sai Vadlamani, Chandler, AZ (US);

Lauren Link, Mesa, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01G 4/33 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01G 4/33 (2013.01); H01L 23/5222 (2013.01); H01L 28/40 (2013.01);
Abstract

Embodiments herein relate to systems, apparatuses, processing, and techniques related to patterning one or more sides of a thin film capacitor (TFC) sheet, where the TFC sheet has a first side and a second side opposite the first side. The first side and the second side of the TFC sheet are metal and are separated by a dielectric layer, and the patterned TFC sheet is to provide at least one of a capacitor or a routing feature on a first side of a substrate that has the first side and a second side opposite the first side.


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