Cemil S Geyik

Title: Innovations of Cemil S Geyik

Introduction

Cemil S Geyik is a notable inventor based in Gilbert, AZ (US). He has made significant contributions to the field of electronic packaging, holding a total of six patents. His work focuses on enhancing the performance and efficiency of semiconductor packages.

Latest Patents

One of his latest patents is titled "Interconnect loss of high density package with magnetic material." This invention includes package substrates and a semiconductor package that utilizes these substrates. The package substrate features a first conductive layer within a first magnetic layer, and a second magnetic layer positioned over the first magnetic layer. Both magnetic layers are composed of magnetic materials, and the substrate also contains a second conductive layer that includes a plurality of first traces fully surrounded by the magnetic layers. The magnetic materials used may include manganese Mn ferrite, Zn/Mn ferrite, or Ni/Zn ferrite, which possess specific material properties that enhance performance.

Another significant patent is "Scalable high speed high bandwidth IO signaling package architecture and method of making." This invention describes electronic packages that incorporate a package substrate with a first routing architecture. The electronic package includes a first die and a second die on the substrate, with the first die electrically coupled to the second die via a bridge embedded in the substrate. Additionally, a routing patch on the substrate is electrically connected to the second die and features a second routing architecture that differs from the first.

Career Highlights

Cemil S Geyik is currently employed at Intel Corporation, where he continues to innovate in the field of electronic packaging. His work has contributed to advancements in high-density packaging solutions, which are crucial for modern electronic devices.

Collaborations

Throughout his career, Cemil has collaborated with notable colleagues, including Kemal Aygun and Zhiguo Qian. These collaborations have fostered a productive environment for innovation and development in their respective fields.

Conclusion

Cemil S Geyik's contributions to electronic packaging through his patents and work at Intel Corporation highlight his role as a significant inventor in the industry. His innovative approaches continue to shape the future of semiconductor technology.