The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2019
Filed:
Sep. 29, 2017
Intel Corporation, Santa Clara, CA (US);
Kemal Aygun, Tempe, AZ (US);
Zhichao Zhang, Chandler, AZ (US);
Cemil Geyik, Chandler, AZ (US);
Guneet Kaur, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Methods/structures of forming package structures are described. Those methods/structures may include a conductive pin comprising: a cantilever beam portion physically coupled with a first side of a package substrate; a contact pin portion, wherein a terminal end of the contact pin portion is physically and electrically coupled to a board; a housing structure comprising a housing cavity, wherein the contact pin portion is disposed at least partially within the housing cavity; and a conductive material disposed on housing sides and/or adjacent a surface of the housing cavity. The placement of the conductive material is optimized to meet the requirements for either double data rate (DDR) and/or peripheral component interface express (PCIe) interfaces.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile