The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Dec. 30, 2022
Intel Corporation, Santa Clara, CA (US);
Sagar Suthram, Portland, OR (US);
Wilfred Gomes, Portland, OR (US);
Nisha Ananthakrishnan, Chandler, AZ (US);
Kemal Aygun, Tempe, AZ (US);
Ravindranath Vithal Mahajan, Chandler, AZ (US);
Debendra Mallik, Chandler, AZ (US);
Pushkar Sharad Ranade, San Jose, CA (US);
Abhishek A. Sharma, Hillsboro, OR (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Embodiments of a microelectronic assembly include: a first integrated circuit (IC) die having a first memory circuit and a second memory circuit, a second IC die; a third IC die; and a package substrate. The first IC die comprises: a first portion comprising a first active region and a first backend region in contact with the first active region; and a second portion comprising a second active region and a second backend region in contact with the second active region. The second portion is surrounded by the first portion in plan view, the first memory circuit is in the first portion, the second memory circuit is in the second portion, the first active region comprises transistors that are larger than transistors in the second active region, and the first backend region comprises conductive traces that have a larger pitch than conductive traces in the second backend region.