The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2026

Filed:

Jun. 29, 2022
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Kristof Darmawikarta, Chandler, AZ (US);

Kemal Aygun, Tempe, AZ (US);

Brandon C. Marin, Gilbert, AZ (US);

Srinivas Venkata Ramanuja Pietambaram, Chandler, AZ (US);

Zhiguo Qian, Chandler, AZ (US);

Jiwei Sun, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/66 (2006.01); H10W 20/00 (2026.01); H10W 42/20 (2026.01); H10W 44/20 (2026.01); H10W 70/05 (2026.01); H10W 70/63 (2026.01); H10W 70/65 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 70/635 (2026.01); H10W 20/056 (2026.01); H10W 42/20 (2026.01); H10W 44/20 (2026.01); H10W 70/093 (2026.01); H10W 70/095 (2026.01); H10W 70/65 (2026.01); H10W 44/248 (2026.01); H10W 90/724 (2026.01);
Abstract

An electronic device includes a substrate including a core layer having a first surface and a second surface opposite the first surface, and at least one coaxial through-hole extending vertically through the core layer from the first surface to the second surface. The coaxial through-hole includes at least a first through-via that includes electrically conductive material extending through the core layer from the first surface to the second surface, and a conductive layer including the same or different electrically conductive material extending vertically through the core layer from the first surface to the second surface and surrounding the first through-via. The conductive layer is to be connected to a ground voltage and is electrically isolated from the first through-via.


Find Patent Forward Citations

Loading…