The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2026
Filed:
Apr. 29, 2022
Intel Corporation, Santa Clara, CA (US);
Cemil Geyik, Gilbert, AZ (US);
Kemal Aygun, Tempe, AZ (US);
Yidnekachew Mekonnen, Chandler, AZ (US);
Zhichao Zhang, Chandler, AZ (US);
Suddhasattwa Nad, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Methods, apparatus, systems, and articles of manufacture to improve signal integrity performance in integrated circuit packages are disclosed. An integrated circuit (IC) package includes a substrate; a first conductive pad in a first metal layer in the substrate; and a second conductive pad in a second metal layer in the substrate. The first metal layer is adjacent the second metal layer with no intervening metal layers therebetween. The integrated circuit (IC) package further includes a conductive protrusion extending from the first conductive pad toward the second conductive pad.